Precision Machined Graphite Parts for Semiconductor Equipment
Product Overview
Our precision-machined graphite parts are custom-manufactured components for semiconductor manufacturing equipment, including wafer handlers, support pins, heater base plates, electrode holders, showerheads, and chamber liners. Machined from ultra-high-purity isostatic graphite with ash content below 50 ppm, these parts meet the stringent contamination requirements of wafer fabrication processes. Each component is CNC-machined to tight tolerances, cleaned, and vacuum-packed to prevent particulate contamination before installation in semiconductor processing chambers.
Semiconductor manufacturing demands graphite components that are dimensionally stable at high temperatures, outgas minimally, and do not introduce metal contaminants into the process chamber. At Jincheng Graphite, we manufacture graphite parts for ion implantation, CVD, PVD, etching, and diffusion equipment. Our engineering team works from customer drawings to produce everything from simple support pins to complex multi-feature chamber components, with available SiC, TaC, or pyrolytic carbon coating options for extended service life and reduced particulate generation.
Key Features
- Ultra-high purity - ash content below 50 ppm for contamination-free semiconductor use
- Precision CNC machining - tolerances as tight as ±0.01 mm on critical features
- Low outgassing - high-temperature baked graphite minimizes chamber contamination
- SiC/TaC coating options - CVD coatings for longer life and reduced particulates
- Cleanroom packaging - individually cleaned and vacuum-sealed for chamber-ready installation
- Custom geometries - pins, plates, holders, showerheads, liners, and complex 3D parts
- Dimensional stability - maintains tight tolerances at process temperatures up to 2000°C
- Reverse engineering service - we replicate worn parts from samples or drawings
Technical Specifications
| Parameter | Value |
|---|---|
| Material | Ultra-high-purity isostatic graphite |
| Bulk Density | 1.82 - 1.88 g/cm³ |
| Ash Content | < 50 ppm |
| Flexural Strength | 55 - 70 MPa |
| Electrical Resistivity | 13 - 16 µΩ·m |
| Thermal Expansion | 2.0 - 2.5 × 10-6/K |
| Machining Tolerance | ±0.01 mm (critical features) |
| Surface Finish | Ra 0.8 - 1.6 µm |
| Coating Options | CVD SiC, TaC, pyrolytic carbon |
| Max Part Size | 500 × 500 × 300 mm |
| Cleaning | Ultrasonic cleaning in DI water, Class 100 packaging |
| Max Operating Temperature | 2000°C (vacuum/inert) |
Applications
- Ion implantation - wafer support and extraction electrodes in implanter chambers
- CVD / epitaxy - susceptors, heater bases, and gas distribution components
- Etch processes - chamber liners, focus rings, and wafer holders
- Diffusion furnaces - wafer boats, support pins, and furnace accessories
- PVD / sputtering - shield plates and electrode components
- Wafer handling - vacuum chucks, lift pins, and robot end effector parts
Why Choose Jincheng Graphite?
- Semiconductor-grade materials - ultra-pure graphite certified for wafer fab use
- Precision machining - 3-axis and 5-axis CNC for complex semiconductor component geometry
- Coating expertise - SiC and TaC coating services for extended component life
- Cleanroom packaging - parts arrive chamber-ready, no additional cleaning needed
- Reverse engineering - we replicate obsolete or worn semiconductor graphite parts
- Quality documentation - material certificates and inspection reports available
- Cost advantage - significant savings over Western semiconductor graphite suppliers
- Global supply - serving semiconductor equipment makers and fab maintenance teams worldwide
FAQ
Q: Can you manufacture a graphite part from our semiconductor equipment drawing?
A: Yes. Send us your CAD file or drawing, specify the required graphite grade and any coating requirement, and we will quote the precision-machined component. We can also reverse-engineer worn parts from physical samples.
Q: What is the difference between standard and semiconductor-grade graphite?
A: Semiconductor-grade graphite has ash content below 50 ppm (vs. 500 ppm for standard grades), finer grain size, and is typically baked and coated to minimize outgassing and particulate shedding in the process chamber.
Q: How does SiC coating benefit semiconductor graphite parts?
A: CVD SiC coating creates a dense, impermeable surface that reduces graphite particle shedding, increases chemical resistance, and extends component service life by 3-5x. It is commonly used for susceptors, showerheads, and chamber liners.
Q: What is the typical lead time for custom semiconductor graphite parts?
A: Standard precision parts typically require 15-25 business days. Complex coated components may require 30-40 days. We offer expedited service for urgent replacement parts.
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