Graphite Plate for Heat Sink Application
Product Overview
Jincheng graphite plates for heat sink applications are high-purity, high-thermal-conductivity graphite panels designed for thermal management in electronic devices, power modules, and LED lighting. These plates provide excellent heat spreading and thermal interface properties for reliable electronic performance.
Our heat sink graphite plates are manufactured from high-density, fine-grain isostatic graphite that provides exceptional thermal conductivity in the plane of the plate. Custom thicknesses and panel sizes are available to match different electronic thermal management requirements.
Key Features
- Excellent in-plane thermal conductivity up to 400-1500 W/m·K depending on graphite type
- Lightweight compared to copper and aluminum heat sink materials
- Good chemical stability for reliable long-term thermal performance
- Custom thickness and size for various electronic thermal management applications
- Precision machined surfaces for good thermal interface contact
- Flexible graphite options for conformable thermal interface materials
- Natural and synthetic graphite options for different performance and budget needs
- Easy to machine and form for custom heat sink designs
Technical Specifications
| Parameter | Value |
|---|---|
| Material Type | Isostatic / flexible / high thermal conductivity graphite |
| Density | 1.70 - 2.20 g/cm3 (grade dependent) |
| In-plane Thermal Conductivity | 400 - 1500 W/m·K (grade dependent) |
| Through-plane Thermal Conductivity | 5 - 20 W/m·K (grade dependent) |
| Shore Hardness | 50 - 80 HS (rigid plates) |
| Flexural Strength | 30 - 70 MPa (rigid plates) |
| Thickness | 0.1 mm - 50 mm (custom) |
| Panel Size | Up to 500 x 1000 mm (custom) |
| Surface Finish | Sawn, ground, or polished |
| Tolerance | ±0.05 mm - ±0.2 mm (thickness dependent) |
Applications
- LED thermal management for high-power LED lighting and display applications
- Power electronics heat sinks for IGBT modules and power semiconductors
- Smartphone and tablet heat spreaders for consumer electronics thermal management
- Electric vehicle battery thermal management for EV battery systems
- Telecom equipment cooling for base station and data center equipment
- Aerospace electronic thermal management for avionics and satellite systems
Why Choose Jincheng Graphite Plates?
- Various graphite grades to match different thermal management requirements and budgets
- Precision machining services for custom heat sink designs and sizes
- Competitive pricing compared to imported high-thermal-conductivity graphite materials
- Fast delivery - standard plates from stock, custom plates within 1 week
- Technical support for graphite grade selection and thermal management design optimization
- Custom coating services available for enhanced thermal interface performance
- Consistent quality with strict thermal conductivity and thickness control
- Global shipping to electronics manufacturers and thermal management companies worldwide
Frequently Asked Questions
Q1: What is the difference between isostatic graphite and flexible graphite for heat sinks?
A: Isostatic graphite plates are rigid, high-strength panels with good dimensional stability, while flexible graphite sheets are conformable and can be used as thermal interface materials. The choice depends on your specific heat sink design and application requirements.
Q2: How does graphite thermal conductivity compare to copper?
A: High-thermal-conductivity graphite can have in-plane thermal conductivity of 1000-1500 W/m·K, which is 2-4 times that of copper (400 W/m·K). However, graphite has much lower through-plane thermal conductivity, so it is typically used for heat spreading rather than direct heat sinking.
Q3: Can you manufacture custom-sized graphite plates?
A: Yes, we manufacture custom-sized graphite plates based on your heat sink design requirements. Please provide your dimensions and thickness specifications for quotation.
Q4: Do you offer graphite plates with adhesive backing?
A: Yes, we can provide graphite plates with pressure-sensitive adhesive backing for easy installation in various electronic thermal management applications.
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