The global digital industry has entered a high-speed expansion cycle in 2026. Driven by generative artificial intelligence, cloud computing and big data storage, the computing power density of global data center servers continues to increase exponentially. High-performance computing servers and GPU cluster equipment generate massive concentrated heat during long-term high-load operation. According to global data center industry monitoring data, the heat flux density of new-generation high-density servers has increased by more than 45% year-on-year, while the traditional air cooling heat dissipation mode relying on fans and radiators has obvious defects such as low heat dissipation efficiency, high energy consumption and large space occupation, which cannot meet the stable operation requirements of high-load computing equipment.
Liquid cooling heat dissipation technology has rapidly replaced traditional air cooling and become the core heat dissipation solution for new-generation ultra-large-scale data centers around the world. By relying on cooling liquid for circulating heat exchange, liquid cooling can achieve efficient overall heat dissipation of server clusters, reduce data center PUE value, and greatly improve energy utilization efficiency. However, the local hot spot concentration problem of server chips, memory modules and power supply components still restricts the further improvement of liquid cooling system stability. Traditional copper and aluminum heat conduction gaskets have low thermal conductivity, poor flexibility and poor fitting performance, which cannot realize seamless heat conduction and rapid heat dissipation of precision electronic components, forming a key technical bottleneck for liquid cooling system iteration.
Ultra-thin high-performance graphite thermal conductive films have completely solved the local heat dissipation pain points of liquid cooling servers and become indispensable core auxiliary materials for global data center upgrading. High-purity oriented graphite thermal films have ultra-high in-plane thermal conductivity, which is 2-3 times that of traditional copper materials, with ultra-low thermal resistance and excellent rapid heat diffusion performance. Different from rigid metal heat dissipation materials, graphite thermal films have excellent flexibility, bendability and ductility, which can be closely attached to irregular precision component surfaces to realize zero-gap heat conduction and eliminate local hot spots of equipment.
In addition, graphite thermal conductive films have the advantages of light weight, corrosion resistance, low thermal expansion coefficient and long service life. They will not produce thermal deformation or performance attenuation during long-term high-temperature and high-frequency operation of servers, and can adapt to the long-term stable operation environment of data centers. Industry data shows that the penetration rate of graphite thermal films in global liquid cooling data centers has risen from 18% in 2025 to 27% in 2026, driving the market scale of data center-grade graphite thermal materials to increase by 32.6% year-on-year, with huge incremental market space.
The production of high-end data center-grade graphite thermal conductive films has strict technical barriers. Ordinary graphite thermal films have problems such as uneven graphite layer orientation, low thermal conductivity, easy layering and poor dimensional stability, which are prone to heat dissipation failure after long-term equipment operation. High-performance thermal films require ultra-high-purity graphite raw material orientation treatment, precise layer thickness control and high-strength composite reinforcement technology, which puts forward extremely high requirements for raw material purification, rolling molding and post-processing technology, and only a few enterprises in the world have mature mass production capacity.
Focusing on the heat dissipation upgrading demand of global digital infrastructure, Jincheng Graphite has independently developed a full range of high-performance ultra-thin graphite thermal conductive film products dedicated to data center liquid cooling systems after years of targeted technical research. The enterprise adopts self-developed high-precision orientation rolling and low-stress composite molding technology to optimize the graphite layer arrangement structure, making the in-plane thermal conductivity of the product stably reach 1800W/(m·K), far exceeding the industry average level, and achieving ultra-efficient rapid heat diffusion.
In terms of product stability optimization, Jincheng Graphite's innovative surface anti-oxidation and anti-layering treatment technology effectively solves the problems of easy aging and layering failure of traditional graphite thermal films in long-term high-temperature operation. The produced thermal films have uniform thickness, stable performance and excellent fitting adaptability, which can perfectly match the heat dissipation needs of various precision server components. After long-term operation verification by international data center operators, the product can effectively reduce the local temperature of server chips by 8-12℃, significantly improving the operation stability and service life of high-density computing equipment.
At present, Jincheng Graphite has built a professional intelligent production line for data center-grade graphite thermal conductive materials, realizing mass production of diversified products including ultra-thin thermal films, thermal conductive gaskets and flexible thermal conductive graphite sheets. The enterprise has reached long-term strategic cooperative relations with many global data center equipment manufacturers and cloud computing enterprises, providing stable high-efficiency heat dissipation material support for the construction of new liquid cooling data centers in Europe, Southeast Asia and North America. With the continuous expansion of global computing power infrastructure, Jincheng Graphite will continue to optimize material thermal conductivity and structural stability, and lead the innovative upgrading of heat dissipation materials for the global digital industry.
